Time-to-market is a critical factor in the success of your product. With strategic
relationships in place with the major foundries and assembly houses, STATS ChipPAC
Taiwan can begin turnkey testing services as soon as your wafers are produced.
STATS ChipPAC Taiwan's research and development team can apply proven techniques
to shorten program development timelines for your product.
With STATS ChipPAC Taiwan's portfolio of advanced test platforms and an experienced
engineering team, STATS ChipPAC Taiwan can reduce your engineering burdens so
your product can be tested and ready to go to market in the shortest time possible.
To ensure you receive the highest level of quality, STATS ChipPAC Taiwan has achieved
top industry certifications including QS9000 / ISO9002, IEC Quality Assessment,
TS16949.
STATS ChipPAC Taiwan offers complete production test services in both wafer sorting
and final testing to our customers. Our close integration and location to the
major Taiwan fabs allow our customers to test their wafers and packaged parts
in Taiwan if they so choose. With over a hundred testers and tester options as
well as multilingual engineers and support staff, STATS ChipPAC Taiwan is well-equipped
to satisfy any customer requests or needs.
Test Platforms
Our test platforms offer STATS ChipPAC Taiwan customers:
- SCAN options
- Mixed-signal options
- High pin count
- Large vector memory
- High speed
- High speed clock options
- Large numbers of time sets
Wafer Probe and Sorting Services 
Our probe services include (but are not limited to):
- Probe card maintenance
- Prober network customization to support real time data processing
- 300mm (12 inch) probing
- Bump probing
- Thin wafer probing
- Multiple site (x16) probing
Engineering Services
Our engineering support services include:
- Yield enhancement including yield monitoring and feedback
- Test time optimization
- Wafer sort to final test correlation studies with recommendations
- Quick-turn failure analysis
- Prototype verification and 1st silicon debug
- Multi-site test implementation
- Test Development and Engineering Support
STATS ChipPAC Taiwan has engineers who are well-qualified to provide customers with ATE transfers and consignments. Our expertise in transfer activity allows STATS ChipPAC Taiwan to increase the speed of your transfer as arising issues can be addressed quickly.
The strength of our test development services comes from STATS ChipPAC Taiwan's extensive background in testing both mixed-signal and digital devices. Customers can expect the some of the best-in-class testing systems and STATS ChipPAC Taiwan's engineering teams to assist in the development of their products.
STATS ChipPAC Taiwan's engineering groups have worked on products including:
- High Performance ASIC and ASSP devices
- System-on-Chip (SOC) or System-in-Package (SiP) devices
- Telecommunication and Networking devices
- Multimedia Processors and Graphics Engines
- CIS and CCD controllers within PSRAM (Pseudo SRAM) and Flash
- CDMA chipsets with embedded lower density memory
- Multiple application devices (Logic & Memory, Analog & Memory, Analog & PLL,
etc.)
 Final
Test
- Direct test offload
- Tester platform conversion
- Device characterization
- Production test coordination
Post Test Services
- Lead Inspection
- Baking
- Packing
- Drop Ship Area
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About Us
STATS ChipPAC Taiwan Semiconductor Corporation and STATS ChipPAC
Taiwan Co., Ltd