STATS ChipPAC Taiwan
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Your Wafer and IC Testing Partner in Taiwan

Our strategic relationship
with top semiconductor fabs
and leading design houses
in Taiwan provides a one-stop
solution and uninterrupted
delivery of services.

 
Turnkey Test Services

As one of the leading test houses in Taiwan, STATS ChipPAC Taiwan offers proven expertise in mixed-signal, digital, embedded memory, consumer optics and wireless applications.
With strategic relationships in place with the major foundries and assembly houses, STATS ChipPAC Taiwan can provide full turnkey test and assembly services for a smooth, uninterrupted delivery of your product. Our portfolio of advanced test platforms, experienced R&D and engineering teams can reduce your engineering burden and ready your product for commercial success in the shortest time possible.

     

Shaping Solutions
in Advanced Semiconductor
Assembly and Test

Now offering full turnkey wafer bump and wafer level packaging for advanced 40um technology		   Wafer Level Processing
and Wafer Bumping Services

As one of the fastest growing package types in the
semiconductor industry, Wafer Level Packages (WLP) offer
a small, lightweight, high performance device that is a cost
effective solution for mobile and consumer applications.
With state-of-the-art 300mm manufacturing capabilities and
advanced process technologies such as low cure temperature
polymers, under bump metallization (UBM) and redistribution
layers (RDL), STATS ChipPAC Taiwan is a leader in wafer
bump and WLP solutions.
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