Now offering full turnkey wafer bump and wafer level packaging for
advanced 40um technology
in Advanced Semiconductor
Assembly and Test
and Wafer Bumping Services
As one of the fastest growing package types
semiconductor industry, Wafer Level Packages (WLP) offer
a small, lightweight, high performance device that is a cost
effective solution for mobile and consumer applications.
With state-of-the-art 300mm manufacturing capabilities and
advanced process technologies such as low cure temperature
polymers, under bump metallization (UBM) and redistribution
layers (RDL), STATS ChipPAC Taiwan is a leader in wafer
bump and WLP solutions.