STATS ChipPAC's Taiwan bump facility, located in Hsin-Chu county is a world-class solder bumping line with HVM production capability for 300mm wafers.

Wafer Bumping Services
Wafer bumping is a process in which interconnections (solder “bumps” or “balls”) are formed on an entire wafer prior to dicing. The use of wafer bumping is driven either by the need for high performance, high I/O densities, small form factor or array interconnect requirements.

300mm Solder Bump
STATS ChipPAC Taiwan’s world-class solder bumping line offers high volume production capability for 300mm wafers. This state-of-the-art facility provides eutectic and solder alloy (low alpha) and leadfree soldering bumping.

Copper Column Bump
Copper column bump provides a high performance, cost effective solution for advanced silicon fab nodes. STATS ChipPAC Taiwan is experienced in copper column bump technology which enables a higher I/O density in very fine bump pitches down to 80um with a higher resistance to electromigration.

Wafer Level Processing
As one of the fastest growing package types in the semiconductor industry, Wafer Level Packages (WLP) offer a small, lightweight, high performance device that is a cost effective solution for mobile and consumer applications. With state-of-the-art 300mm manufacturing capabilities and advanced process technologies such as low cure temperature polymers, under bump metallization (UBM) and redistribution layers (RDL), STATS ChipPAC Taiwan is a leader in wafer bump and WLP solutions.

Wafer level packages differ from laminate and leadframe based packages in that all of the manufacturing process steps are performed in parallel at the silicon wafer level rather than sequentially on individual semiconductor chips. A Wafer Level Chip Scale Package (WLCSP) is essentially the same size as the die, providing a high performance package in a more compact package footprint than conventional manufacturing processes. At STATS ChipPAC Taiwan, WLCSPs are manufactured with advanced process technologies such as electroplated copper RDL and UBM to achieve higher densities and increased reliability for customers.

View our Services Datasheet for more information on our process capabilities.