STATS ChipPAC's Taiwan bump facility, located in Hsin-Chu
county is a world-class solder bumping line with HVM production capability for
Wafer Bumping Services
Wafer bumping is a process in which interconnections
(solder “bumps” or “balls”) are formed on an entire wafer prior
to dicing. The use of wafer bumping is driven either by the need
for high performance, high I/O densities, small form factor or array
300mm Solder Bump
STATS ChipPAC Taiwan’s world-class solder
bumping line offers high volume production capability for 300mm
wafers. This state-of-the-art facility provides eutectic and solder
alloy (low alpha) and leadfree soldering bumping.
Copper Column Bump
Copper column bump provides a high performance,
cost effective solution for advanced silicon fab nodes. STATS ChipPAC
Taiwan is experienced in copper column bump technology which enables
a higher I/O density in very fine bump pitches down to 80um with
a higher resistance to electromigration.
Wafer Level Processing
As one of the fastest growing package types in the
semiconductor industry, Wafer Level Packages (WLP) offer
a small, lightweight, high performance device that is a cost
effective solution for mobile and consumer applications.
With state-of-the-art 300mm manufacturing capabilities and
advanced process technologies such as low cure temperature
polymers, under bump metallization (UBM) and redistribution
layers (RDL), STATS ChipPAC Taiwan is a leader in wafer
bump and WLP solutions.
Wafer level packages differ from laminate and leadframe
based packages in that all of the manufacturing process
steps are performed in parallel at the silicon wafer level
rather than sequentially on individual semiconductor chips.
A Wafer Level Chip Scale Package (WLCSP) is essentially the
same size as the die, providing a high performance package
in a more compact package footprint than conventional
manufacturing processes. At STATS ChipPAC Taiwan, WLCSPs
are manufactured with advanced process technologies such
as electroplated copper RDL and UBM to achieve higher
densities and increased reliability for customers.
View our Services
Datasheet for more information on our process capabilities.